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JAGUAR Automation
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Stencil Printer PCB Screen Printing Machine Solder Paste Printer
| Price: | 1.0 USD |
| Payment Terms: | T/T,L/C,D/A,D/P,WU,Paypal,Money Gram |
| Place of Origin: | Guangdong, China (Mainland) |
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Product Detail
Stencil Printer PCB Screen Printing Machine Solder Paste Printer
Stencil Printer PCB Screen Printing Machine Solder Paste Printer
Specification
* The following data is measured under environment temperature of 25 ºC and humidity of 60%.
| Items | Parameter | ||
| Repeat Position Accuracy | ±0.01mm | ||
| Printing Accuracy | ±0.025mm(Absolute Guarantees) | ||
| Cycle Time | <11s (Excluding Printing & Cleaning) | ||
| Products Changeover | <5Min | ||
| Screen Stencil Size/Min | 737mm X 737mm(Note: Cleaning Adhesive tape shall be replaced for 737mm stencil) | ||
| Screen Stencil Size/Max | 1100mm X 900mm | ||
| Screen Stencil Thickness | 20mm ~ 40mm | ||
| PCB Size/Min | 100X80mm | ||
| PCB Size/Max | 850X500mm | ||
| PCB Thickness | 0.8~6mm | ||
| PCB Warpage Ratio | <1%(Based on diagonal length) | ||
| Bottom of Board Size | 13mm(standard configuration), 25mm(optional configuration) | ||
| Edge of Board Size | 3mm | ||
| Transport Height | 900±40mm | ||
| Transport Direction | Left-Right; Right-Left; Left-Left; Right-Right | ||
| Transport Speed | 100-1500mm/sec Programmable | ||
| Board Location | Support System | Magnetic pin/ Side support block/ Flexible automatic pin(optional) | |
| Clamping System | Elastic side clamping/Vacuum nozzle/Elastic Z-direction tabletting(optional) | ||
| Print head | Programmable integrated motor driven and pneumatic control print head | ||
| Squeegee Speed | 10~200mm/sec | ||
| Squeegee Pressure | 0~0.5MPa with adjustable pressure reducing meter valve | ||
| Squeegee Angle | 60°(Standard)/ 55°/ 45° | ||
| Squeegee Type | Steel squeegee (standard), rubber squeegee, customizable other types of squeegee. | ||
| Stencil Separation Speed | 0.1~20mm/sec Programmable | ||
| Cleaning Methods | Dry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods) | ||
| Table Adjustment Range | X: ±4mm;Y:±6mm;θ:±2° | ||
| Type of Image Fiducial Mark | Standard geometry shape of fiducial mark, bonding pad / stencil hole | ||
| Camera System | Single digital camera with upward/downward vision system | ||
| Air Pressure | 4~6Kg/cm2 | ||
| Air Consumption | Approx 0.07m3 /min | ||
| Control Method | PC Control | ||
| Power Supply | AC:220±10%,50/60HZ 1Φ 1.5KW | ||
| Machine Dimensions | 1740mm(W) x 1560mm(D) x 1510(H)mm (excluding the height of indicating lighthouse) | ||
| Weight | Approx:1300Kg | ||
| Operation Temperature | -20°C ~ +45°C | ||
| Operation Humidity | 30%~60% | ||
Product Functions:
Machine is a high accuracy extra dimension solder paste printer designed for high precision screen printing or stencil printing in SMT industry.
2. Product Features:
a) Wide compatibility for PCB dimensions from 100mm x 80mm to 850mm x 500mm and PCB thickness from 0.8mm to 6mm.
b) High printing resolution
1. High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm.
2. Support glue printing.
c) Automatic control improves production efficiency, quality control and saves production cost:
1. Automatic stencil positioning
2. Automatic PCB alignment
3. Automatic adjustment of squeegee pressure
4. Automatic printing
5. Automatic stencil cleaning (dry-type, wet-type and vacuum-type)
d) Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
e) Programmable motor controls squeegees separation speed and distance among squeegees, steel mesh and substrate board to realize multi-method separation.
f) Multi-functional PCB positioning and clamping system for fast, convenient and accurate PCB positioning.
g) Upward and downward visual positioning.
h) Built-in image processing system
i) Support 2D,SPC functions
3. Applicable pitches of Components
a) SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.
b) IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm.
c) Printing size:100mm x 80mm ~850 mm x 500 mm
d) PCB Thickness:0.8 mm ~ 6 mm
e) FPC Thickness:thickness<= 0.8 mm (excluding jig)
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Company Info
JAGUAR Automation [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
